INVESTIGATION OF PROBE FAILURE
During testing it was found that this probe was the culprit of a larger article’s performance failure. We CT scanned the unit to produce a full characterization of the part. A variety of indications were located in the scan:
> Foreign Object Debris (FOD)
>> Linear indications and pathways in the potting
>>> Porosity and gas holes in the solder pads
INDICATIONS VISUALIZED
The yellow arrows below point out the indications like FOD and potting pathways. The pathway travels the full length of the potting.
The below images show the porosity and gas holes in the joints, as well as large holes in the potting.
