When the pinnacle of INSPECTION and engineering collide
Industrial Inspection pushes the limits of electronics inspections by using digital X-ray imaging to provide the highest quality data on the market – like with the Nintendo Switch 2.
Why? Because flawless fit and build quality isn’t a guessing game. With our expertise every button cutout, every vent alignment, and every curve is built on cold, hard data.
HIGH RESOLUTION CT SCAN OF SWITCH 2
GAME PORT ACTION
We X-rayed the Nintendo Switch 2’s game card slot both with and without a cartridge inserted to analyze changes in the internal contact mechanisms. By comparing the two states, we can observe how the spring-loaded pins engage, check for any mechanical interference, and confirm how the system physically and electrically connects to the game card.
JOYCON CONNECTION
HIGH RESOLUTION ELECTRONICS INSPECTION
X-ray inspection of the Nintendo Switch 2’s internal electronics reveals generally high-quality solder joints, with consistent wetting and minimal voiding. However, we did observe some porosity — small gas pockets or voids — especially in the larger ground pads and under certain BGA components. These are common in high-density consumer electronics and usually fall within industry standards, but their presence is worth noting for anyone evaluating long-term reliability or thermal performance.
