1991 Topps Desert Shield CT Scan

1991 TOPPS DESERT SHIELD CT SCAN

Topps released a special set of Desert Shield trading cards to commemorate the events surrounding Operation Desert Shield. The set was produced in 1991 and was aimed at capturing the significance of the operation. 

Most still-sealed packs of this product are considered fake. Before CT scanning the only way to authenticate them would be for a professional to open the wrapping to confirm the shield, seen below, was present. Now, we can non-destructively confirm the presence of the shield.

X-ray Inspection of PCB Solder Joint Porosity

DIGITAL X-RAY INSPECTION OF PCBs

 

X-ray inspection is used to inspect the quality and reliability of products containing electronics by revealing hidden defects such as soldering issues, voids, misalignments, and component damage that may not be visible externally. By identifying potential problems early in the production process, X-ray inspection helps prevent failures, reduce rework costs, and enhance the overall performance and longevity of these products. This post demonstrates three inspection tools made possible using high resolution digital x-ray imaging..

1. Solder Pad Fill

X-ray is used to ensure that the solder completely fills the pad to create a strong, conductive joint.

PCB Pad Fill Solder Evaluation 1 PCB Pad Fill Solder Evaluation 2

2. fpga wire sweep analysis

X-ray is used to examine the deformation of bonding wires within a microchip package which could potentially cause electrical shorts

3. SOLDER JOINT POROSITY X-RAY INSPECTION

X-ray is used to detect small air pockets or voids within the solder joints of a printed circuit board. We follow custom quality standards provided by our clients to identify areas where process adjustments might be needed. For example, automotive porosity standards typically call for less than 20% porosity in any joint.