FOD & Potting Failure in Probe

INVESTIGATION OF PROBE FAILURE

During testing it was found that this probe was the culprit of a larger article’s performance failure. We CT scanned the unit to produce a full characterization of the part. A variety of indications were located in the scan:

> Foreign Object Debris (FOD)

>> Linear indications and pathways in the potting

>>> Porosity and gas holes in the solder pads

INDICATIONS VISUALIZED

The yellow arrows below point out the indications like FOD and potting pathways. The pathway travels the full length of the potting.

The below images show the porosity and gas holes in the joints, as well as large holes in the potting.

Volumetric Porosity & Cracks in PCB Housing

INVESTIGATING A FAILED LED HOUSING

This LED housing has failed. It was sent to us to try to locate the point of failure, which is equivalent to finding a needle in a haystack. The point of failure is seen in one of the two images below. Can you spot it before moving to the next section of the post?

LED Housing 1a
LED Housing 2a

point of failure

While porosity calculations are interesting, typically an individual joint has a 20% porosity tolerance which can usually be gauged visually. Porosity is not the failure of this part.

If you look near the yellow arrow you’ll see a vertical, linear indication or fracture in the component. During evaluation the inspector uses multiple viewing directions for each component to find such small points of failure. If this crack were perpendicular to the viewing direction it likely would not have been found.

Industrial Inspection is ITAR Registered

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